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2nd International Symposium on Photonic Packaging

November 13th 2008 in Munich, Germany
2nd International Symposium on Photonic Packaging

IEEE LEOS

The 2nd International Symposium on Photonic Packaging is co-chaired by David R. Selviah, an academic from the department of Electronic and Electrical Engineering, UCL. The conference is co-located with the very large Electronica Electronic Components exhibition

At the symposium, international experts from research and industry will address how to handle the challenges of growing demand for higher data rates, higher interconnection density and low power. The discussion topics will include Roadmaps and System Requirements, Design and Components, System Integration and PCB Technology, Assembly and Reliability and many more.

Apart from providing a platform for scientific discussion, the event is also an excellent opportunity to present new project ideas and to network with colleagues from the scientific community. Don’t miss this opportunity to get up to date with current developments in photonic packaging!

For further information, please visit: www.izm.fraunhofer.de/photonics